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Single/Double-side metallization
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Single/Double-side metallization
Single/Double-side metallization
Line Width:
≥0.01mm
Lines Gap:
≥0.01mm
Diameter of plated thru via:
≥0.20mm / ≥1/2 thickness of Substrate
Gap between vias:
≥One diameter
Gap Between Vias and Substrate Edge:
≥One diameter
Gap between vias and metalized edge:
≥0.0635mm
Metallization Thickness:
TiW or Ti 0.03-0.08 μm / Ni or Pt 0.1-1μm / Au 0.5-10μm / Cu 0.5-25 μm
Resistor Length and Width:
≥0.0254mm
Resistor Length and Width:
≥0.05mm
AuSn Thickness:
4-6 μm
Single/Double-side metallization