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Hengcera Electronics is an advanced technological enterprise combined with R&D, manufacture & sales and is committed to innovation and promotion of electronic ceramics , which will be our contribution to the localization of this industrial chain.
The thin-film circuits we provide are widely used as carrier of chip in photonic communication, submount of LD, heatsink, the components of filter and amplifier in microwave communication, etc.
We aways adhere to the management idea of “Excellence, Simplicity and Pleasure", develop R&D and production furtherly in field of thin-film circuits with ceramic substrate to produce high-quality products, which will be our contribution to the upgrading and localization of this industrial chain.
Our target is to be an advanced enterprise in our industry, pay attention to high quality, are proficient in professional knowledge, rely on professional & lean teams and management to provide customers with first-class and cost competitive products.
To be a world-class supplier of
electronic ceramic products
Improve day by day and create high-quality products & characteristic service to complete the localization of the industry chain of electronic ceramic products.
We aways adhere to the management idea of “Excellence, Simplicity and Pleasure", are committed to building to professional team and lean management structure and try our best to simplify the workflow to provide dignified and pleasant working environment for every employee.
Our products are widely applied in the field of photonic communication, chip packaging, radar, microwave communication, electric vehicle, consumer electronics, etc.
Provide first-class products
Focus on high quality
Proficient in professional knowledge
Simplify workflow to support and
feed back to customers at first time.
Provide customers with cost competitive products
Shanghai Hengcera Electronics Co., Ltd. is a subsidiary company under Shanghai Hengcera Technology, and focuses on thin-film circuits with ceramic substrate and DPC substrate. It is a high-tech enterprise combined with R&D, manufacture and sales. The thin-film circuits with ceramic substrate are widely used as carrier of chip in photonic communication, submount of EML LD, the components of filter and amplifier in microwave communication, etc. DPC substrates are widely applied in the field of powerful LED, semiconducting LD, VCSEL, etc.
Headquarter:
No.550, Minqiang Rd. Xinqiao town, Songjiang district, Shanghai, China
+86 21 57765188
👤 Mr Liu 13501958630
liuj@hengcera.com
NanJing Office:
Rm.2111, Jiangsu Yishiyuan Mansion, No.95 North Zhongshan Rd. Nanjing City
+86 25 83108081
👤 Mr You 18120195140
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