Resistor sputtered

• Line Width： ≥0.01mm
• Line Space(Gap)： ≥0.01mm
• Diameter of Via Hole： ≥0.20mm ≥1/2 thickness of Substrate
• Gap Between Via Holes： ≥One diameter
• Gap Between Via Holes and Substrate Edge： ≥One diameter
• Gap Between Via Holes and metalized Edge： ≥0.0635mm
• Metallization Thickness： TiW or Ti 0.03-0.08 μm / Ni or Pt 0.1-1μm / Au 0.5-10μm / Cu 0.5-25 μm
• Resistor Length and Width： ≥0.0254mm
• AuSn Length and Width： ≥0.05mm
• AuSn Thickness： 4-6 μm