H
E
N
G
C
E
R
A
Loading...Please wait...
Plated thru Vias
-
Line Width:
≥0.01mm
-
Lines Gap:
≥0.01mm
-
Diameter of plated thru via:
≥0.20mm / ≥1/2 thickness of Substrate
-
Gap between vias:
≥One diameter
-
Gap Between Vias and Substrate Edge:
≥One diameter
-
Gap between vias and metalized edge:
≥0.0635mm
-
Metallization Thickness:
TiW or Ti 0.03-0.08 μm / Ni or Pt 0.1-1μm / Au 0.5-10μm / Cu 0.5-25 μm
-
Resistor Length and Width:
≥0.0254mm
-
AuSn Length and Width:
≥0.05mm
-
AuSn Thickness:
4-6 μm