H
E
N
G
C
E
R
A
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AuSn prepared
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Line Width:
≥0.01mm
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Lines Gap:
≥0.01mm
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Diameter of plated thru via:
≥0.20mm / ≥1/2 thickness of Substrate
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Gap between vias:
≥One diameter
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Gap Between Vias and Substrate Edge:
≥One diameter
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Gap between vias and metalized edge:
≥0.0635mm
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Metallization Thickness:
TiW or Ti 0.03-0.08 μm / Ni or Pt 0.1-1μm / Au 0.5-10μm / Cu 0.5-25 μm
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Resistor Length and Width:
≥0.0254mm
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AuSn Length and Width:
≥0.05mm
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AuSn Thickness:
4-6 μm