Physical drawing of ceramic substrate
Characteristics and application of DPC
- Direct Plating Copper
- High insulation, high thermal conductivity and high surface flatness
- High insulation, high thermal conductivity and high surface flatness
- The minimum line width and spacing can reach 20 μm. Line accuracy error ＜± 1%, surface flatness ＜ 0.3 μm
- Application: high power LED, semiconductor laser
